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Rumah > Produk > Kawat pengikat >
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs

Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs

gold alloy bonding wire

silver alloy bonding wire

IC packaging bonding wire

Tempat asal:

Tiongkok

Nama merek:

WINNER

Sertifikasi:

ISO9100

Nomor model:

MW001

Hubungi Kami
Minta Kutipan
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs
Rincian produk
Aplikasi:
Kemasan semikonduktor, mikroelektronika, perangkat medis
Kemasan:
Kumparan
Ketahanan korosi:
Tinggi
Bahan:
Emas
Meter panjang:
500/1000
Jenis Produk:
Kawat ikatan
Lapisan:
Emas
Metode ikatan:
Ultrasonik
Kisaran Suhu:
-40 ° C hingga 200 ° C.
Permukaan akhir:
Terang
Daya konduksi:
98%
Menyoroti:

gold alloy bonding wire

,

silver alloy bonding wire

,

IC packaging bonding wire

Syarat Pembayaran & Pengiriman
Kuantitas min Order
1 buah
Harga
999
Kemasan rincian
Gulung, pengepakan neutrial atau dengan logo OEM
Waktu pengiriman
5-8 hari kerja
Syarat-syarat pembayaran
L/C, Western Union, T/T
Menyediakan kemampuan
100000 gulungan per bulan
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Harga yang bagus 24K Gold Bonding Wire 1mm Diameter for Microelectronics with 4N 99.99% Purity on line Video

24K Gold Bonding Wire 1mm Diameter for Microelectronics with 4N 99.99% Purity

Dapatkan Harga Terbaik
Hubungi Kami
Hubungi Sekarang
Deskripsi Produk
Gold Bonding Wire Au99.99% - 100m Per Spool (0.025mm Diameter)
High purity 99.99% (4N) fine gold wire for scientific research, medical, aerospace, and electrical applications. Offers excellent electrical properties and low reactivity for stability in harsh environments.
Material Gold
Diameter 0.0125, 0.05, etc. mm
Form Wire
Purity ≥99.99%
Gold wire provides exceptional electrical conductivity and durability, making it ideal for precision applications requiring stability in demanding conditions. Available in round or ribbon form, pure or mixed with beryllium for semiconductor applications.
Medical Applications
  • Electrosurgery equipment
  • Guide wires and stents
  • Life-support devices
  • Medical markers for X-rays (provides radiopacity)
  • CV therapies
  • In vitro diagnostic devices
Aerospace Applications
  • Wire-wound potentiometers
  • Aerospace instrumentation (avionics)
  • Radio communication equipment
  • Temperature regulation sensors
Electrical Applications
  • Imaging devices and televisions
  • Smartphones and computers
  • LED technology
  • Orthodontic appliances
  • Wire bonding for integrated circuits
  • Motherboard connections and microprocessor mounting
Product Images
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs 0
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs 1
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs 2
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs 3
Tag：

Aluminium Bonding Wire

kawat ikatan kawat

Aluminium bonding wire

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