Rumah
Produk
Kawat pengikat
Kawat Tungsten Lapis Emas
Kawat tembaga dilapisi emas
Kawat Molibdenum Lapisan Emas
Kawat Tungsten
Kawat Perak Lapisan Emas
Kawat tembaga lapis paladium
Kawat tembaga ultra halus
Beryllium copper wire
Probe pengujian musim semi
Layanan Electroplating Emas
Video
Tentang kita
Profil Perusahaan
Tur Pabrik
Kontrol Kualitas
Hubungi kami
Acara
Berita
Kasus-kasus
indonesian
english
français
Deutsch
Italiano
Русский
Español
português
Nederlandse
ελληνικά
日本語
한국
العربية
हिन्दी
Türkçe
indonesia
tiếng Việt
ไทย
বাংলা
فارسی
polski
Rumah > Produk > Kawat tembaga lapis paladium >
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections

Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections

15um palladium coated copper wire

ultra fine palladium copper wire

chip packaging palladium coated wire

Tempat asal:

Cina

Nama merek:

WINNER

Sertifikasi:

ISO9100

Nomor model:

PW-12

Hubungi Kami
Minta Kutipan
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Rincian produk
Ketebalan lapisan:
5 mikron
Kisaran suhu:
-40°C hingga 150°C
Tersedianya:
Tersedia ukuran khusus
Daya konduksi:
98%
Konduktivitas listrik:
Bagus sekali
Standar kepatuhan:
RoHS, JANGKAUAN
Warna:
Perak
Kekuatan Tarik:
Tinggi
Kemurnian:
99,9% tembaga
Permukaan akhir:
Lapisan paladium halus dan mengkilat
Ukuran Paket:
100 meter
Kekuatan tarik:
Tinggi
Kisaran suhu pengoperasian:
-40°C hingga 150°C
Bahan pelapis:
Paladium
Permukaan Selesai:
Lapisan paladium halus dan mengkilat
Bahan Pelapis:
Paladium
Menyoroti:

15um palladium coated copper wire

,

ultra fine palladium copper wire

,

chip packaging palladium coated wire

Syarat Pembayaran & Pengiriman
Kuantitas min Order
1 buah
Harga
999
Kemasan rincian
Gulung, pengepakan neutrial atau dengan logo OEM
Waktu pengiriman
5-8 hari kerja
Syarat-syarat pembayaran
L/C, Western Union, kemampuan pasokan T/T
Menyediakan kemampuan
100000 gulungan per bulan
Produk terkait
Harga yang bagus Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections on line

Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections

Dapatkan Harga Terbaik
Harga yang bagus High Conductivity Anti-Oxidation Palladium Copper Wire with 98% Conductivity for Microelectronics on line

High Conductivity Anti-Oxidation Palladium Copper Wire with 98% Conductivity for Microelectronics

Dapatkan Harga Terbaik
Harga yang bagus High Conductivity Anti-Oxidation Palladium Copper Wire with 99.9% Purity for Microelectronics on line

High Conductivity Anti-Oxidation Palladium Copper Wire with 99.9% Purity for Microelectronics

Dapatkan Harga Terbaik
Harga yang bagus Corrosion Resistant Palladium Coated Copper Bonding Wire with Ultrasonic Bonding and High Thermal Conductivity for Semiconductor Packaging on line

Corrosion Resistant Palladium Coated Copper Bonding Wire with Ultrasonic Bonding and High Thermal Conductivity for Semiconductor Packaging

Dapatkan Harga Terbaik
Hubungi Kami
Hubungi Sekarang
Deskripsi Produk
Ultra Fine Palladium Coated Copper Wire 15um 20um 25um Bonding Wire for Chip Packaging
Product Overview

Ultra fine Pd coated copper bonding wire designed for advanced chip packaging with fine pitch and high-density interconnections.

  • Available in 15μm, 20μm, and 25μm diameters
  • Palladium coating for enhanced performance
  • Ideal for fine pitch applications
  • Optimized for high-density interconnections
  • Advanced chip packaging solutions


Company Information
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections 0 Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections 1 Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections 2 Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections 3
Tag：

Kawat tembaga lapis paladium

PD berlapis kawat cu

Ketahanan korosi pd kawat cu berlapis

Kirim pertanyaan Anda langsung ke kami

Telp：86-158-1857-6616
E-mail：sales@winner-sc.com
Tentang Kami
Profil Perusahaan
Tur Pabrik
Kontrol Kualitas
Sitemap
Acara
Berita
Kasus-kasus
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Sichuan WINNER Special Electronic Materials Co., Ltd. berfokus pada kawat logam berlapis ultra-halus untuk kemasan semikonduktor.
Kami akan menghubungi Anda sesegera mungkin.
Kebijakan Privasi Cina Kualitas Baik Kawat pengikat Pemasok. Hak cipta © 2024-2026 SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD. Semua hak dilindungi.