Bonding Aluminum Wire

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Bonding Aluminum Wire

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November 04, 2024

Category Connection: Kawat pengikat

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#Aluminium Bonding Wire #kawat ikatan kawat #Aluminium bonding wire

Brief: Discover the Ultrasonic Laser Aluminum Bonding Wire with Composite Material Treatment, designed for high-performance applications in servers and systems. Made from 6N high-purity aluminum with trace elements, this wire is ideal for power semiconductor packaging and various electronic bonding needs.

Related Product Features:

Made from 6N high-purity aluminum material with trace elements for superior performance.
Widely used in power semiconductor packaging like MOSFET, IGBT, Thyristor, and more.
Available in multiple diameters (100μm to 200μm) to suit various applications.
Offers excellent breaking load and elongation properties for durability.
Suitable for automotive electronics, consumer electronics, and computing equipment.
Ideal for chip on board (COB) technology and bonding of discrete components.
Comes in lengths of 500, 1000, or 2000 meters for flexible usage.
Enhances performance in servers and systems with composite material treatment.

Pertanyaan:

What is the Ultrasonic Laser Aluminum Bonding Wire used for?

It is used for power semiconductor packaging, automotive electronics, consumer electronics, and bonding discrete components like diodes and transistors.
What are the available diameters for the aluminum bonding wire?

The wire is available in diameters ranging from 100μm to 200μm, with specific options like 100±5μm, 125±5μm, 150±5μm, 170±5μm, and 200±7μm.
Can I get samples of the aluminum bonding wire?

Yes, samples are available upon request to help you evaluate the product for your specific needs.