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November 27, 2024

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#Aluminium Bonding Wire #kawat ikatan kawat #Aluminium bonding wire

Brief: Discover the Premium Ultra Fine Wire Gold Bonding Wire, designed for advanced electronic bonding applications. With a purity of up to 99.99%, this wire ensures superior performance in high-temperature and high-humidity environments. Ideal for microelectronic devices and high-power components, it offers extreme reliability and excellent corrosion resistance.

Related Product Features:

Ultra-high purity gold bonding wire with 99.99% purity for superior performance.
Ideal for high pin-count, ultra-fine pitch microelectronic devices.
Excellent corrosion resistance and high tensile test performance.
Low-impact ball and wedge bonding with superior looping performance.
Wide processing window and extreme bond reliability.
Higher fusing current than standard Al bond wire.
Available in a complete range of wire diameters for diverse applications.
Customizable tensile strength and elongation to meet specific requirements.

Pertanyaan:

What makes gold bonding wire preferable over aluminum or copper?

Gold bonding wire is preferred when the contact material is incompatible with aluminum or copper, the contact area is limited, or the device will be exposed to high temperature or high humidity environments.
What are the key advantages of using gold bonding wire?

Gold bonding wire offers extreme bond reliability, a wide processing window, low-impact ball and wedge bonding, superior looping performance, high tensile test performance, excellent corrosion resistance, and higher fusing current than standard Al bond wire.
What diameters are available for the gold bonding wire?

The gold bonding wire is available in diameters ranging from 0.7 mil (17.5 μm) to 3.0 mil (75 μm), catering to various strength and elongation requirements.