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Rumah > Produk > Kawat tembaga lapis paladium >
China Semiconductor Palladium Coated Copper Wire For Bonding

China Semiconductor Palladium Coated Copper Wire For Bonding

Tempat asal:

Cina

Nama merek:

WINNER

Sertifikasi:

ISO9100

Nomor model:

PW-12

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Minta Kutipan
China Semiconductor Palladium Coated Copper Wire For Bonding China Semiconductor Palladium Coated Copper Wire For Bonding China Semiconductor Palladium Coated Copper Wire For Bonding China Semiconductor Palladium Coated Copper Wire For Bonding China Semiconductor Palladium Coated Copper Wire For Bonding
Rincian produk
Kemasan:
Kumparan
Permukaan Selesai:
Terang
Ketahanan Korosi:
Tinggi
Tersedianya:
Tersedia ukuran khusus
Bahan:
Tembaga
Jenis Produk:
Kawat ikatan
Lapisan:
Paladium
Meter panjang:
500/1000
Kisaran Suhu:
-40 ° C hingga 200 ° C.
Daya konduksi:
98%
Ukuran paket:
100 meter
Kekuatan Obligasi:
Tinggi
Syarat Pembayaran & Pengiriman
Kuantitas min Order
1 buah
Harga
999
Kemasan rincian
Gulung, pengepakan neutrial atau dengan logo OEM
Waktu pengiriman
5-8 hari kerja
Syarat-syarat pembayaran
L/C, Western Union, kemampuan pasokan T/T
Menyediakan kemampuan
100000 gulungan per bulan
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Harga yang bagus Ultra Thin Coating Layer Pd Coated Copper Bonding Wire For QFN / QFP Packaging on line

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Dapatkan Harga Terbaik
Harga yang bagus China Semiconductor Palladium Coated Copper Wire For Bonding on line

China Semiconductor Palladium Coated Copper Wire For Bonding

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Deskripsi Produk
Palladium Coated Copper Bonding Wire

Palladium Coated Copper Wire (Pd-Coated Cu Wire) is a composite conductor material in which a uniform ultra-thin layer of palladium is plated onto the surface of high-purity copper wire. It is widely used in semiconductor packaging, power devices, and high-reliability electronic applications.

Its core advantage lies in combining the high electrical conductivity and cost efficiency of copper with the excellent oxidation and corrosion resistance provided by the palladium coating.

Key Advantages
  • Enhanced bonding performance and stability
  • Superior oxidation control on copper surface
  • Extended HAST (Highly Accelerated Stress Test) reliability
  • Corrosion protection against halide attack from molding compounds
  • Wider bonding parameter window
Performance Benefits
  • High bonding reliability is obtained by stable palladium distribution to FAB surface layer
  • High and stable stitch bondability
  • Wide bonding window
Company Information 
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Tag：

Kawat tembaga lapis paladium

PD berlapis kawat cu

Ketahanan korosi pd kawat cu berlapis

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